Tin-Lead Electroplating
Tin-Lead electroplating, sometimes called “Solder Plate”, is widely used for functional soldering applications. Consisting of a mixture of tin and lead, Solder Plate deposit is most commonly used in electronics applications where solderability is a requirement, though there are commercial uses in a wide variety of additional industries.
Tin-Lead is plated in a wide variety of common formulations and custom mixes are available, as well.
Benefits
-
Excellent solderability
-
Corrosion protection
-
Oxidation resistance
-
Abrasion resistance
-
Etch resistance
-
Superior at preventing “whisker” formation compared to 100% pure Tin
- The growth of tin whiskers can cause short circuit electronic components by bridging conductor paths
Select Applications / Industries
-
Electronics
-
Defense
-
Aerospace
-
Battery / Power Storage
-
Fire Protection
Physical Properties / Specs
-
Coating Thickness:
-
Unless otherwise specified .0003 to .0005 inches
-
Aesthetic Appearance:
-
Silvery gray
-
Finishes - Either matte or bright luster
-
If a brighter finish is called for we typically suggest either a final re-flowing of Tin-Lead or even a coating of Bright Tin
Substrates
-
Ferrous: All ferrous alloys including many Steel alloys
-
Cuprous: Pure Copper and all cuprous alloys including Copper Molybdenum, Copper Beryllium (BeCu), Copper Tellurium (TeCu), Brass & more
-
All Aluminum Alloys Including Wrought, Cast and Proprietary Alloys (MIC-6)
-
Exotics & Others: Inconel, Kovar, Monel, Tellurium, Magnesium, Nickel, Lead & more
Underplates
-
Copper
-
Electrolytic Nickel
-
Electroless Nickel
-
Silver
-
Tin
-
Lead
Pre-Treatments Available
-
Mechanical Cleaning
-
Custom Masking
-
Chemical Films
Post-Treatments Available
-
Laser Marking
-
Engraving
-
Chemical Films
-
Hydrogen Embrittlement Stress Relief
Types & Grades
-
10-90
-
60/40
-
90/10
-
95/5
-
93/7
-
Custom mixes
Specs & Certifications
-
ASTM B579
-
AMS-P-81728
-
MIL-P-81728 --- NADCAP Approved, ROHS Compliant
-
MIS-41177
-
Various company specifications
Please Note
-
For electronic components use only parts with a matte or flow brightened finish
-
The ratio of Tin and Lead in a given composite will affect both hardness and the melting point of the final plating
-
For example, abrasion resistance increases with increased tin in the composite
-
For example, the melting point for Tin-Lead 60/40 ~374F (190C) and for 90/10 is ~421F (217C)
-
-
The lead-free electronic manufacturing directives mandated by the European Union have had a far reaching and ongoing impact on the use of Tin-Lead. AOTCO stands ready to work with you to define your options and advise which will be most suitable for the end goal for your part.
Contact Us
Depending on your end goals Tin-Lead could be an excellent option for your surface finishing needs. If you have a unique part, specialized needs or simply want to work with the best, please reach out and let us know how we can help you achieve the results you need.