MIL-C-26074 Technical Information

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MIL-C-26074 Technical Information

With MIL-C-26704, there are a few key classifications an informed customer should understand.

  1. Grades – Thickness of Deposit
    1. Grade A (1000 microinches) – used for aluminum based alloys
    2. Grade B (500 microinches) – used for copper, nickel, cobalt, titanium, and beryllium
    3. Grade C (1500 microinches) – used for iron-based alloys
  2. Class Number – Processing Guidelines
    1. Class 1 – As plated, no subsequent heat treatment. A bake for hydrogen embrittlement relief is not considered a heat treatment.
    2. Class 2 – heat treated to obtain required hardness: May be used on all metals not affected by heating to 500 degrees Fahrenheit and above.
    3. Class 3 – Aluminum alloys nonheat-treatable, and beryllium alloys processed to improved adhesion of the nickel deposit.
    4. Class 4 – Aluminum alloys, heat-treatable, processed to improve adhesion of the nickel deposit.

Acceptable Base Metals:

Iron, copper, aluminum, nickel, cobalt, beryllium, titanium, and their respective alloys.

Strikes and Underplating:

Silver or copper plus silver may not be used as an underplate.  When gold is applied to a copper rich surface such as brass, copper, bronze, or beryllium copper, an anti-diffusion underplate such as nickel shall be applied.